FOLDED FRAME CARRIER FOR MOSFET BGA

摘要

A folded frame carrier has a die attach pad (DAP) (30) and one or more folded edges (32, 33, 34, 35). Each folded edge has one or more studs (36) and each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or copper alloy. Multiple folded frame carriers may be formed between opposite rails of a lead frame. The folded edges are cut with a relief groove. The tips are formed in edges of the DAP and then the tips are folded upright. The tips provide electrical connection to the terminal on the rear surface of a power semiconductor mounted on the DAP.