INPUT AND OUTPUT TERMINAL FOR SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

An input and output terminal for a semiconductor package and a method for manufacturing the semiconductor package using the same are provided to improve flexibility according to thermal mechanical stress and adhesive power by using a flexible polymer thin film tube for improving the input and output terminal with a ring-type structure. An input and output terminal of a ring-type structure consists of a flexible polymer tube, a nickel or chrome layer plated on the flexible polymer tube, a copper layer plated on the nickel or chrome layer, and a solder layer plated on the copper layer. A jig is provided with matrix-arranged receiving grooves(22). A plurality of holding pins(26) are arranged on a holding unit at regular intervals. The input and output terminal is inserted into the receiving grooves of the jig. The holding pins are inserted into center holes of the input and output terminal which is half inserted into the receiving holes of the jig, thereby fixing the input and output terminal. After the jig is turned over, the input and output terminal is fused and fixed to an input and output terminal attachment region of a substrate for a semiconductor package manufacture.