发明名称 |
WIRING BOARD FOR A LGA TYPE SEMICONDUCTOR DEVICE, A LGA TYPE SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION OF WIRING BOARD FOR A LGA TYPE SEMICONDUCTOR DEVICE |
摘要 |
In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate. |
申请公布号 |
KR100820531(B1) |
申请公布日期 |
2008.04.08 |
申请号 |
KR20070026160 |
申请日期 |
2007.03.16 |
申请人 |
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发明人 |
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分类号 |
H01L21/60;H01L23/12;H01L23/498;H05K1/11;H05K3/24;H05K3/34;H05K3/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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