POLISHING PAD

摘要

Disclosed is a polishing pad which is free from center-slow problems while having a good polishing rate and excellent life characteristics. Specifically disclosed is a polishing pad having a polishing layer which is made of a polyurethane resin foam having fine air bubbles. A high molecular weight polyol component as a raw material component for the polyurethane resin foam contains a hydrophobic high molecular weight polyol A having a number-average molecular weight of 550-800 and another hydrophobic high molecular weight polyol B having a number-average molecular weight of 950-1,300 at a weight ratio A/B of 10/90-50/50.