| 摘要 |
<p>A grinding pad whereby optical material for lenses, reflecting mirrors and the like, or a material requiring a high degree of surface flatness, as in the grinding of glass substrates or aluminum substrates for silicone wafers and hard disks, or general metal grinding, can be flattened with stability and high grinding efficiency. Further, a grinding pad for semiconductor wafers is provided that is superior in flattening characteristic and free from scratches and that can be produced at low cost. A grinding pad is provided that is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. A grinding pad is provided that is satisfactory in flatness, in-plane uniformity, and grinding speed and that produces less change in grinding speed. A grinding pad is provided that can make planarity improvement and scratch decrease compatible.</p> |
