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发明名称
Grooves formed around a semiconductor device on a circuit board
摘要
申请公布号
USD566060(S1)
申请公布日期
2008.04.08
申请号
US20050240188F
申请日期
2005.10.11
申请人
NITTO DENKO CORPORATION
发明人
OHSAWA TETSUYA;TANI EMIKO
分类号
主分类号
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