| 摘要 |
A semiconductor device is provided to reduce the thickness of an under-fill resin sandwiched between a semiconductor chip and a low-elasticity resin member, by making the first distance between the semiconductor chip and the low-elasticity resin member smaller than the second distance between an electrode pad and an outer connection pad, thereby minimizing the warp of the semiconductor device as keeping the size small. A semiconductor device(10) comprises a semiconductor chip(14), an inner connection terminal(15), an outer connection pad(12), a low-elasticity resin member(11), and an under-fill resin(16). The semiconductor chip comprises a plurality of electrode pads(28). The inner connection terminal is installed on the electrode pads. The outer connection pad is electrically connected to the electrode pad through the inner connection terminal. The low-elasticity resin member is placed opposite to a surface(14A) of the semiconductor chip with the electrode pads formed thereon. The under-fill resin is filled between the semiconductor chip and the low-elasticity resin member, representing the first distance, and between the electrode pad and outer connection pad, representing the second distance, wherein the first distance is smaller than the second distance. The low-elasticity resin member has an elastic modulus less than that of the under-fill resin. |
