发明名称 Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring
摘要 Disclosed are embodiments of a method for forming a seal ring on a substrate that is anchored to the substrate by a number of vias. Also disclosed are embodiments of an assembly including such an anchored seal ring. In some embodiments, a seal ring may extend around the periphery of a MEMS device and may, in combination with a lid, provide a hermitic cavity enclosing the MEMS device. Other embodiments are described and claimed.
申请公布号 US7354799(B2) 申请公布日期 2008.04.08
申请号 US20050269443 申请日期 2005.11.08
申请人 INTEL CORPORATION 发明人 KINDERKNECHT DANIEL J.;DAMBRAUSKAS TONY
分类号 H01L21/00;H01L29/06 主分类号 H01L21/00
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