发明名称 |
Electronic parts packaging method and electronic parts package |
摘要 |
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.
|
申请公布号 |
US7355126(B2) |
申请公布日期 |
2008.04.08 |
申请号 |
US20020311476 |
申请日期 |
2002.12.16 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHIKAWA HIDENOBU;NISHIDA KAZUTO;SHIMIZU KAZUMICHI;ONO SHUJI;OTANI HIROYUKI |
分类号 |
H05K1/16;H01L21/56;H01L21/60 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|