发明名称 Printed circuit board and chip module
摘要 The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a printed circuit board having an improved signal return path for basically all relevant signal layers at transitions between card, connector, module and chip while still holding the cross-section structure simple, it is proposed to establish a layer structure wherein a) a split voltage plane is located adjacent to one side of one of said reference planes and comprises conducting portions for all of said at least three different voltage levels in respective plane parts, and b) a signal layer being located adjacent to said reference planes.
申请公布号 US7355125(B2) 申请公布日期 2008.04.08
申请号 US20050281688 申请日期 2005.11.17
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BECKER WIREN D.;CHAMBERLIN BRUCE J.;FRECH ROLAND;HUBER ANDREAS;KATOPIS GEORGE;KLINK ERICH;REBMANN ANDREAS;WINKEL THOMAS-MICHAEL
分类号 H05K1/03 主分类号 H05K1/03
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