SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
摘要
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
申请公布号
KR20080031204(A)
申请公布日期
2008.04.08
申请号
KR20077030001
申请日期
2006.06.19
申请人
FAIRCHILD SEMICONDUCTOR CORPORATION
发明人
JEON, O SEOB;CHOI, YOON HWA;GOOI BOON HUAN;ESTACIO MARIA CRISTINA B.;CHONG DAVID;KENG TAN TEIK;NAM, SHI BAEK;JOSHI RAJEEV;WU CHUNG LIN;IYER VENKAT;LIM LAY YEAP;LEE, BUYONG OK
