| 摘要 |
A semiconductor package and a manufacturing method thereof are provided to use a coating layer one tenth thinner than an existing coating layer and to realize excellent corrosion resistance. One or more die attaching pad mounts a semiconductor chip(26). Plural terminals(20) are formed around the die attaching pad. The terminals are selected form a group consisting of a capacitor, an inductor, and a contact pad. Plural bonding wires(38) apply an electric current to the terminals and the semiconductor chip. An insulating sealing material seals the semiconductor chip, the terminal, and the bonding wire. The die attaching pad or the terminal include a bottom finish layer and a top finish layer comprised of an Au coating layer(50) of 0.003 - 15 mum, a Pd+Co alloy coating layer(60) of 0.01 - 0.15 mum, and a Ni coating layer(70) of 0.5 - 2.5 mum. A Pd content of the Pd+Co alloy coating layer is 50 - 99.9 wt%. |
