| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining sufficiently high heat radiation efficiency even in a semiconductor chip having a small number of bumps and a high heat radiation capability, securing reliability by evading the defective operation and damage of the semiconductor chip and achieving reduced cost production with reel-to-reel high productivity. SOLUTION: The semiconductor device is provided with a film base material 14, an inner lead 13 formed on the film base material, a semiconductor chip 11 connected to the inner lead, a first tape carrier having an insulating resin 16 for sealing a connection area of the semiconductor chip to the inner lead, a film 22 on which a device hole larger than the semiconductor chip is formed, and a second tape carrier 3a having a metal foil 21a formed on one surface of the film so as to cover the device hole; wherein, the semiconductor chip is arranged in the device hole, the first tape carrier is stuck to the second tape carrier and the rear face of the surface of the semiconductor chip which is connected to the inner lead is made to contact with the metal foil. COPYRIGHT: (C)2008,JPO&INPIT |
