发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that is provided with a radiator for efficient cooling of exhaust gas, while preventing a heat plate from melting. SOLUTION: An exhaust hood, an exhaust duct, a damper case, and a radiator case 100 are connected to a cooling air path that is formed between a process tube of a batch-type hot wall CVD apparatus and a heater unit surrounding the process tube, and a radiator 110 is installed in the radiator case 100. A plurality of first heat plates in an inlet 104 area of the radiator 110 are made of a material mainly containing iron, and a plurality of second heat plates in the outlet 105 area of the radiator 110 are made of a material that has higher thermal radiation property than those of the first heat plate. Thus, since while the heat plate is prevented from melting, heat exchange performance can be ensured, even if the heat plate is quenched at 1,000°C, a low-temperature gas, kept at a predetermined temperature, can be discharged safely from the outlet. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078196(A) 申请公布日期 2008.04.03
申请号 JP20060252815 申请日期 2006.09.19
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKEKUMA YUKIHIKO;KAGAYA TORU;MARUYAMA KUNIO;MORIKAWA HARUO;SUGIURA SHINOBU
分类号 H01L21/205;C23C16/44;H01L21/22;H01L21/324 主分类号 H01L21/205
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