| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical communication apparatus exhibiting high solder junction strength and excellent reliability, and to provide its manufacturing process. SOLUTION: The optical communication apparatus has an optical communication component 1 provided with an Au film 2 on the surface, and a thermoelectric module 8 connected onto the optical communication component 1 by a solder principally comprising Sn wherein an AU film 4 is provided on the connection surfaces. The metal texture of a junction layer 9 connecting the optical communication component 1 and the thermoelectric module 8 through a solder consists of a phase 10 principally comprising Sn and an AuSn<SB>4</SB>phase 11 which is not deposited in the thickness direction within the junction layer 9. COPYRIGHT: (C)2008,JPO&INPIT
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