发明名称 |
PRINTED CIRCUIT BOARD AND METHODE THEREOF |
摘要 |
A PCB(Printed Circuit Board) and a manufacturing method thereof are provided to simplify a manufacturing process by forming a through hole with silver paste. A manufacturing method of a PCB includes the steps of: cutting substrate raw material with a cutter(S1); forming a component insertion hole and a through hole on the cut substrate(S2); forming a circuit pattern on the substrate(S4); performing solder mask printing on the substrate(S8); performing a solder through hole printing process by printing silver paste on the through hole of the substrate(S10); drying the substrate(S11); treating a surface of a land of the substrate with Sn(S12); over-coating the substrate(S13); and processing and coating an external form(S14).
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申请公布号 |
KR20080029073(A) |
申请公布日期 |
2008.04.03 |
申请号 |
KR20060094589 |
申请日期 |
2006.09.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, CHUNG SEOK |
分类号 |
H05K3/42 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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