发明名称 PRINTED CIRCUIT BOARD AND METHODE THEREOF
摘要 A PCB(Printed Circuit Board) and a manufacturing method thereof are provided to simplify a manufacturing process by forming a through hole with silver paste. A manufacturing method of a PCB includes the steps of: cutting substrate raw material with a cutter(S1); forming a component insertion hole and a through hole on the cut substrate(S2); forming a circuit pattern on the substrate(S4); performing solder mask printing on the substrate(S8); performing a solder through hole printing process by printing silver paste on the through hole of the substrate(S10); drying the substrate(S11); treating a surface of a land of the substrate with Sn(S12); over-coating the substrate(S13); and processing and coating an external form(S14).
申请公布号 KR20080029073(A) 申请公布日期 2008.04.03
申请号 KR20060094589 申请日期 2006.09.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, CHUNG SEOK
分类号 H05K3/42 主分类号 H05K3/42
代理机构 代理人
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