| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition that produces a relief structure having excellent breaking elongation properties, exhibits high sensitivity and high film retention, has a small change in pattern size during heating after a lithography process, forms a stable pattern and forms a film having high breaking elongation and to provide a method for manufacturing a semiconductor apparatus using the composition. <P>SOLUTION: The polybenzoxazole precursor has a specific terminal structure. The photosensitive resin composition contains the precursor. The method for manufacturing a semiconductor apparatus comprises using the composition. <P>COPYRIGHT: (C)2008,JPO&INPIT |
