| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a printed circuit board with an extremely flat thick wiring circuit that contains no void, air bubbles and the like. SOLUTION: The method of manufacturing the printed circuit board featuring that the coating (loading) of a curable insulating material is performed under reduced pressure is provided. It is with reference to the method of manufacturing the printed circuit board with the thick wiring circuit, where at least the curable insulating material is coated (loaded) and cured in the concave portion between the circuits. COPYRIGHT: (C)2008,JPO&INPIT |
