| 摘要 |
<p>A stacked semiconductor package is provided to significantly increase a connection area of leads of semiconductor packages by disposing leads of respective semiconductor packages between two semiconductor packages and connecting the leads interposed between the semiconductor packages through solder paste. A stacked semiconductor package comprises a first semiconductor package(100) and a second semiconductor package(200). The first semiconductor package includes a first semiconductor chip(110), a first mold structure(120), and a first lead(130). The first semiconductor chip has first bonding pads. The first semiconductor chip is wrapped with the first mold structure. The lead includes a first lead portion(131) electrically connected to the first bonding pads and a second lead portion(132) disposed at an upper portion of the first mold structure. The second semiconductor package includes a second lead(220), a second semiconductor chip(210), and a second mold structure(230).The second lead includes a third lead portion(222) engaging with the second lead portion. The second semiconductor chip is electrically connected to the second lead. The second semiconductor chip is wrapped with the second mold structure.</p> |
