| 摘要 |
PROBLEM TO BE SOLVED: To provide an application-specific semiconductor integrated circuit for which the degree of integration can be improved by increasing the number of wirings per unit area, and to provide a manufacturing method therefor. SOLUTION: The application-specific semiconductor integrated circuit 1 is provided with a wiring 51, extending in a first direction and a second wiring 52 extending parallel to the wiring 51, which are disposed on a first wiring layer; and a wiring 61, extending on the first wiring 51 and the second wiring 52 in a second direction and connected to the wiring 51 through a connection hole 71, a wiring 63 spaced from the wiring 61 and extending parallel thereto on the wiring 51 and the wiring 52, and a wiring 62 spaced in the minimum space for both the wirings between the wirings 61 and 63, extending parallel thereto and connected to the wiring 52 through a connection hole 72, which are disposed on a second wiring layer. One end 620 of the wiring 62 extends from the wiring 52 to the center, in between the wiring 52 and the wiring 51. COPYRIGHT: (C)2008,JPO&INPIT
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