| 摘要 |
PROBLEM TO BE SOLVED: To enable continuous production of a large surface area of pattern with less environmental load. SOLUTION: A method of forming a conductive pattern forming on a surface of a substrate 11 includes a hydrophilic treatment step of selecting the substrate 11 having a hydrophobic and applying a hydrophilic treatment to a conductive pattern formation area 12 of the surface of the substrate 11 for the conductive pattern to be formed; a metallic-particle layer forming step of bringing a hydrophilic solution 14 containing metallic particles, a binder, and a solvent into contact with the surface of the substrate 11 and selectively applying the solution 14 to the conductive pattern formation area 12 subjected to the hydrophilic treatment and solidifying the solution to form a metallic particle layer 14A; and a plating step of electrolessly plating or electroplating the surface of the substrate 11 having the metallic particle layer 14A formed thereon to form a plated layer. COPYRIGHT: (C)2008,JPO&INPIT
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