| 摘要 |
PROBLEM TO BE SOLVED: To individually drive stacked memory chips connected together through vias. SOLUTION: The signals inputted to the control pads 12 are outputted to an RST buffer 25, a CE buffer 26, a WE buffer 27, an RE buffer 28, a CLE buffer 29, and an ALE buffer 30 of respective memory chips 2. The chip address comparator 24 compares its own chip address INTCAi stored in the fuse 23 with the chip address EXTCAi inputted from the address buffer 17 and outputs whether they match or not as the address flag signal CAFLG to the CE buffer 26. When the address flag signal CAFLG is "H", a chip enable signal CE' is outputted from the CE buffer 26, and data are written or read to/from the memory chip 2. COPYRIGHT: (C)2008,JPO&INPIT
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