发明名称 |
Electrical Circuit Package |
摘要 |
An electrical circuit package comprises a ceramic substrate ( 1 ) with an electrical circuit pattern formed on one surface thereof, an opposite surface of the substrate being metallized, and an electrically conductive platelet ( 2 ) and a conductor body ( 3 ), arranged so that a first face of the platelet is soldered to the metallized surface of the substrate and an opposite face of the platelet is affixed in contact with the conductor body. A method of constructing the package is also described.
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申请公布号 |
US2008080141(A1) |
申请公布日期 |
2008.04.03 |
申请号 |
US20050663573 |
申请日期 |
2005.08.04 |
申请人 |
KROKOSZINSKI HANS-JOACHIM;HELFRICH JENS;DISSELNKOTTER ROLF |
发明人 |
KROKOSZINSKI HANS-JOACHIM;HELFRICH JENS;DISSELNKOTTER ROLF |
分类号 |
H05K7/20;H05K1/03;H05K3/00;H05K3/28;H05K3/30;H05K3/34;H05K5/06 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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