发明名称 |
Hard mask for low-k interlayer dielectric patterning |
摘要 |
Described herein are embodiments of a hard mask including a surface to reduce adhesion to an anti-reflective material deposited on a surface, wherein the surface to reduced adhesion provides use of a process to remove the anti-reflective material deposited on the surface that minimizes damage to an interlayer dielectric layer below the hard mask and methods of manufacturing the same.
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申请公布号 |
US2008079155(A1) |
申请公布日期 |
2008.04.03 |
申请号 |
US20060540528 |
申请日期 |
2006.09.28 |
申请人 |
MULE TONY V;ABDELRAHMAN MAGDY S |
发明人 |
MULE TONY V.;ABDELRAHMAN MAGDY S. |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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