| 摘要 |
A lighting system includes a leadframe, and a light active sheet material laminated on the leadframe and electrically connected to the leadframe. The light active sheet material includes a transparent electrically conductive top substrate, a pattern of one or more light emitting diode (LED) chip(s) sandwiched between the leadframe and the top substrate, and a non-conductive transparent adhesive material disposed between the leadframe, the LED chip(s), and the top substrate. The LED chip(s) is (are) preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side. Either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe.
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