SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS ALONG A SIDE EDGE THEREOF

摘要

A method of depositing a solder mass (300) within a plated opening (120) that is formed in a side edge of an electronic device (100) includes the step of carrying the solder mass (300) in a carrier device (200) and orienting the carrier device (200) with respect to the side edge such that the solder mass is aligned with the plated opening (120) The method further includes reflowing the solder mass (300) to cause the solder mass (300) to be deposited and securely held within the plated opening (120) and then removing the carrier device (200) leaving the solder mass (300) behind within the plated opening (120) and along the side edge of the electronic device (100)