| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and its manufacturing method, which can be easily manufactured and whose internal resistance can be made further lower. <P>SOLUTION: The semiconductor device comprises: a semiconductor element 3; a lead 4 having an electrode connected to an electrode provided on the semiconductor element 3; and a metal film 6 for electrically connecting the electrode of the semiconductor element 3 and the electrode of the lead 4. <P>COPYRIGHT: (C)2008,JPO&INPIT |
