| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a terminal section to a resin mold section strongly even in a state where the terminal section is separated by half cut dicing. <P>SOLUTION: A terminal section 4 for connecting a semiconductor chip 1 in a resin mold section 5 to the outside has an internal terminal section 7 buried to the resin mold section 5 and an external terminal section 8 that is overlapped with the internal terminal section 7 in a laminated state and is partially exposed to the bottom surface of the resin mold section 5. A plurality of pairs of terminal sections 4 are arranged in a cascaded state; the internal terminal section 7 at both the terminal sections 4 has a wide section 9 that is wider than the external terminal section 8; a resin penetration section 16 where a mold resin has entered is provided between respective pairs of wide sections 9 or between the external terminal sections 8; and respective pairs of terminal sections 4 are parted by a half-cut dicing groove 17 from the bottom surface of the resin mold section 5 at the resin penetration section 16. <P>COPYRIGHT: (C)2008,JPO&INPIT |
