| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board for mounting high-frequency chips which can be formed thin without degrading characteristics of circuit elements of a flip-chip mounted high-frequency chip, especially Q of an inductor, and to provide a high-frequency circuit module. <P>SOLUTION: The high-frequency circuit module 1 is formed by flip-chip mounting a high-frequency chip 2 to a multilayer wiring board 3 for mounting high-frequency chips. In the multilayer wiring board 3 for mounting high-frequency chips, an intermediate layer 5 is stacked under a surface layer 4, and a first ground surface 6a is formed in the ground layer 6 of the intermediate layer 5. The first ground surface 6a is provided with an opening 6b at a position opposite to an circuit element (especially inductor) 2a. In addition, a lower layer 8 is stacked under the intermediate layer 5, and a second ground surface 8a is formed under the opening 6b in the lower layer 8. The ground surface 8a is 200μm or more away from the opening 6b. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
