| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board, provided with reinforcing means for preventing warpages for suppressing the occurrence of warpages, while reducing the thickness. SOLUTION: In the multilayer wiring board formed with a plurality of laminated layers of wiring layers 105, 108, and 110 and insulating layers 104, 106, and 107, among a plurality of the insulating layers 104, 106, and 107, the insulating layer 106 located at the laminating center to the laminating direction is an insulating layer reinforced with braces. COPYRIGHT: (C)2008,JPO&INPIT |
