| 摘要 |
PROBLEM TO BE SOLVED: To make it easy to derive a heating temperature profile of a substrate. SOLUTION: A reflow device 1 of this invention is equipped with a conveyor 6 which conveys the substrate in a reflow furnace 3. In the reflow furnace 3, a preliminary heating portion X, a main heating portion Y and a cooling portion Z are provided in a sequential order. The substrate conveyed by the conveyor 6 is heated in each heating portion and is cooled in the cooling portion Z. Furthermore, since the reflow furnace 3 is equipped with a thermal blocking tunnel 2 which adjusts a heating temperature of the substrate, the heating temperature of the substrate can be adjusted more detailedly. In result, the heating temperature profile of a desired substrate can be easily derived. COPYRIGHT: (C)2008,JPO&INPIT |
