INTERDIGITATED LEADFINGERS

摘要

One embodiment of the present Invention includes an integrated circuit (IC) package. The IC package comprises a semiconductor die comprising at least one IC. The semiconductor die can include a plurality of conductive elements disposed on a first surface of the semiconductor die. The IC package also comprises a die pad coupled to a second surface of the semiconductor die. The IC package further comprises a leadframe comprising a plurality of leadfingers to which a portion of the conductive elements are conductively coupled. At least a portion of the plurality of leadfingers can be interdigitated with at least a portion of the die pad.