| 摘要 |
A chip structure including an integrated circuit (IC) element, a plurality of bumps and at least one spacer is provided. The IC element has a plurality of contacts. The bumps are disposed on the contacts respectively. The spacer is disposed on the IC element and between two of the bumps adjacent to each other, and the thickness of the spacer is less than or equal to that of the bumps. Through the arrangement of the spacer, the two bumps are well insulated from each other. Furthermore, a manufacturing process of the chip structure and a chip package with the chip structure are also provided.
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