发明名称 ACID MODIFIED EPOXY (METH)ACRYLATE COMPOUND, PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITE CONTAINING THE COMPOUND, AND HARDENED MATERIAL OF THE COMPOSITE
摘要 An acid-modified epoxy (meth)acrylate compound is provided to cause no crack on the cured film thereof in the hot and cold cycle test and form a coating film having excellent finger sensing dryness, alkali developing property, development life, and PCT resistance. An acid-modified epoxy (meth)acrylate compound is obtained by reacting (a) an unsaturated group-containing epoxy compound having two epoxy groups in a molecule represented by the following formula 1 with (b) an unsaturated group-containing monocarbonic acid to obtain a reaction product, and then reacting the reaction product with (c) a polybasic acid anhydride. In the formula 1, M represents a hydrogen atom or -COOA, wherein at least one M is -COOA, X is a bifunctional aromatic group and/or an alkyl group and/or a cyclohexyl group, Y is a trifunctional and/or tetrafunctional aromatic group, A is an moiety of an unsaturated group-containing monoalcohol, and n is 1-100.
申请公布号 KR20080029341(A) 申请公布日期 2008.04.03
申请号 KR20060095276 申请日期 2006.09.29
申请人 JAPAN U-PICA COMPANY, LTD. 发明人 MOROIWA TETSUJI;MAEDA YASUHIRO
分类号 C08L63/10;C08L33/00 主分类号 C08L63/10
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