PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A PCB(Printed Circuit Board) and a manufacturing method thereof are provided to reduce an etching amount due to permeation of a plating solution into an interface between a sliver core substrate and a copper plating layer. A manufacturing method of a PCB includes the steps of: laminating a plating resist on a core substrate with a metal layer on a surface and selectively etching a part of the plating resist in correspondence to a circuit pattern(S20); applying power to the metal layer to selectively deposit a first plating layer on the metal layer to correspond to the circuit pattern(S30); and applying power to the metal layer to deposit a second plating layer on the first plating layer to correspond to the circuit pattern(S40).