| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip-chip mounting device that has high productivity and reliability, which is applicable to flip-chip mounting of the next generation LSIs. <P>SOLUTION: A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are arranged in a facing relation to each other; and resin 13 containing conductive particles 12 and an air bubble generating agent is supplied into a gap formed therebetween. The resin 13 is heated in this state; air bubbles 30 are generated from the air bubble generating agent contained in the resin 13; the generated air bubbles 30 grow; and accordingly, the resin 13 is extruded. The extruded resin 13 is self-assembled into a columnar shape between terminals of the circuit board 10 and the semiconductor chip 20. In this state, the semiconductor chip 20 is pressed against the circuit board 10; and thereby, the conductive particles 12 contained in the resin 13 self-assembled between opposed terminals are brought into contact with each other and connections between the terminals are made. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
