MANUFACTURING METHOD OF MULTILAYER PRINT CIRCUIT BOARD, MULTILAYER PRINT CIRCUIT BOARD AND VACUUM PRINTER

摘要

PROBLEM TO BE SOLVED: To provide a multilayer print circuit board capable of performing inter-layer connection without manufacturing a mask by eliminating a wet process, and capable of manufacturing a multilayer print circuit board with high reliability.

SOLUTION: A manufacturing method of a multilayer print circuit board includes steps of: (a) preparing a substrate; (b) forming wiring on the substrate by an ink jet system; (c) forming an insulating layer on the substrate by using a thermosetting high-polymer compound; (d) forming a via hole by irradiating the insulating layer with a laser beam; and (e) filling the inside of the via hole with the paste of a metal nano-particle by a vacuum printing system.

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