发明名称 LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame capable of improving the insulation between not less than two stage sections without upsizing, and supporting not less than two stage sections stably. SOLUTION: A connection tape 41 made of an insulator is applied between a stage section 21 and a stage section 22. As a result, the stage section 21 and the stage section 22 form an integral stage section. Therefore, in the stage section 21 and the stage section 22, edges 211, 221 are restricted by the connection tape 41, thus limiting a free movement, allowing support sections 31, 32 and support sections 33, 34 to stably support the integral stage sections 21, 22, and hence limiting the number of support sections and reducing an inner lead 12 consumed for supporting the stage sections 21, 22. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078445(A) 申请公布日期 2008.04.03
申请号 JP20060256971 申请日期 2006.09.22
申请人 YAMAHA CORP 发明人 OKAWA SHINYA
分类号 H01L23/50 主分类号 H01L23/50
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