| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize an oscillator, to attain reduction in power consumption, and further to provide a temperature controllable oscillator with superior temperature characteristics. SOLUTION: A temperature controlled piezoelectric oscillator 1 mounts a SAW device 4 on the inner bottom surface of a package 3, with a recessed portion 2 formed inside so that a second surface, with a heating object integrally formed, faces the inner bottom surface of the package 3, mounts an IC chip 5 with a built-in temperature sensor, a temperature control circuit and an oscillation circuit side by side in the SAW device 4, and is air-tightly sealed by a lid 6, after prescribed wire bonding. The temperature-controlled piezoelectric oscillator 1 heats the SAW device 4 to a prescribed temperature by using the temperature control circuit built in the IC chip 5. COPYRIGHT: (C)2008,JPO&INPIT
|
