| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the solder joint structure of a wiring board for thinning an application product by limiting the thickness of a joint below the thickness of one wiring board. <P>SOLUTION: Under a state where the board end faces 111 and 211 provided with the connection terminals 121 and 221 of a main flexible wiring board 1 and a light driving flexible wiring board 2 to be conduction bonded are abutting, the connection terminals 121 and 221 of four pairs of corresponding interconnections 12 and 22 extending on a substantially straight line are conduction connected, respectively, by solder 3. Since the thickness at a conduction joint becomes substantially equal to the thickness of a thicker one of the flexible wiring boards 1 ad 2, thinning of a liquid crystal module is promoted. <P>COPYRIGHT: (C)2008,JPO&INPIT |
