发明名称 WIRING BOARD AND MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain built-in of a capacitor element which has high capacity of capacitance density, between layers of a multi-layer wiring board with proper productivity at low cost, while the reliability and proper yield are ensured in the built-in of the capacitor element. <P>SOLUTION: In the capacitor element, a second electrode is formed on a dielectric sheet, which has been formed by continuous film formation of a diffusion preventing layer and a dielectric layer on a copper foil. After a dielectric sheet, having four-layer structure made up of a first electrode, a diffusion preventing layer, a dielectric layer, and a second electrode has been laminated on a wiring board in the middle of lamination, the copper foil is etched, and the capacitor element is separated on the wiring board in the middle of lamination. Then, an insulating layer is formed on the capacitor element, and by having the capacitor element is connected to a wiring pattern via a via hole formed on the electrode of the capacitor element, the capacitor element is incorporated in the wiring board. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008078547(A) 申请公布日期 2008.04.03
申请号 JP20060258686 申请日期 2006.09.25
申请人 TOPPAN PRINTING CO LTD 发明人 FURUYA AKIHIKO;SAEKI AKIKO
分类号 H05K3/46;H01L23/12;H05K1/16 主分类号 H05K3/46
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