| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the resonance of an electromagnetic field between the conductor surfaces of parallel plate parts in a printed wiring board and a semiconductor device, provided with the parallel plate parts formed with the conductor surfaces facing each other. <P>SOLUTION: In the printed wiring board and the semiconductor device, provided with the parallel plate parts formed with the conductor surfaces facing each other, a resonance wiring which resonates with the resonance frequency of the electromagnetic field between the parallel plate parts is provided in a conductor layer between the conductor surfaces of the parallel plate parts; the total area of the resonance wiring is set to be≥2% and≤50% of the area of the parallel plate parts; the resonance wiring is electrically connected to the conductor surfaces at the side part of the parallel plate parts via an electric resistor so that the resonance of the electromagnetic field between the parallel plate parts is suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
