| 摘要 |
A light emitting device is provided to enhance heat-radiating performance by forming a heat-radiating plate including silver having high thermal conductivity. A substrate includes lead patterns formed at one side and the other side thereof. A heat-radiating plate(108) is formed at an upper surface and a lateral surface of the substrate. A light emitting chip(120) is mounted on the heat-radiating plate to be electrically connected to the lead patterns. The heat-radiating plate is extended to a lower surface of the substrate. A heat slug penetrates the substrate. The heat slug is connected to the light emitting chip and the heat-radiating plate. The lead patterns include a first and a second lead pattern(104a,104b). The heat-radiating plate is formed between the first and the second lead pattern. |
