| 摘要 |
A method for manufacturing a bump in a semiconductor chip is provided to decrease a bump forming time by forming the bump on a bump pad, after a sheet is attached to one surface of the semiconductor chip. Bump pads(110) are arranged on a semiconductor chip(100). Electrical elements and circuit lines are formed in the bump pads. The bump pads are connected to the circuit lines. An adhesive member is applied on the side, where the bump pads are arranged, such that a sheet is attached to the semiconductor chip. A portion of the sheet, which corresponds to the bump pads, is opened. A seed metal(120) is formed on an upper surface of the bump pads, which is exposed to outside of the sheet. A bump forming metal is laminated on the seed metal. Heat is applied on the bump forming metal, such that a ball-type bump is formed on the bump pad. |
