| 摘要 |
An adhesive composition is provided to form an adhesive layer having excellent electric characteristics, especially low dielectric constant and low dielectric loss while maintaining sufficient adhesive performance. An adhesive composition contains (A) a copolymer including (a-1) a structural unit derived from a monomer having at least two ethylenically polymerizable unsaturated groups and (a-2) a structural unit derived from a monomer having an alcoholic hydroxyl group, (B) a thermosetting resin, and (C) a hardener. A substrate for a flexible print wiring board includes an insulating film layer, a circuit substrate, and an adhesive layer which is formed by the adhesive composition and is disposed between the insulating film layer and the circuit substrate to glue the insulating film layer and the circuit substrate together. |
