发明名称 LIGHT-EMITTING ELEMENT, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To suppress a reduction of a luminous efficacy of a light-emitting element after element dividing when a substrate is element-divided from a compound semiconductor by laser irradiation. <P>SOLUTION: A nitride semiconductor 5 is formed on a substrate 2. The nitride semiconductor 5 is etched along a location where element dividing lines 3, 4 are formed, to form an element dividing trench 12. Laser beams are irradiated toward the element dividing trench 12, whereby the element dividing lines 3, 4 are formed and an altered part 11 is formed in the substrate 2 along the element dividing lines 3, 4. The altered part 11 is formed discontinuously and linearly to a direction along the element dividing lines 3, 4. The substrate 2 is element-divided by using the altered part 11 as the cardinal point, to manufacture the light-emitting element 1. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078440(A) 申请公布日期 2008.04.03
申请号 JP20060256777 申请日期 2006.09.22
申请人 DOWA HOLDINGS CO LTD 发明人 ARAKI TAKASHI;TOYODA TATSUNORI
分类号 H01L33/32;B23K26/38;B23K26/40;B23K101/40;B28D5/00;H01L21/301 主分类号 H01L33/32
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