| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a LED module which can manufacture easily and at low cost the LED module having sufficient air tightness. <P>SOLUTION: The method for manufacturing the LED module includes a first process to remove moisture by heating a resin material to a constant temperature, a second process to reheat at a proper temperature the material primarily heated in the first process by introducing it into a heating machine, a third process to arrange in a first upper and lower mold a base body constituted by installing LEDs in a printed circuit board and applying electric wire connections to the LEDs, a fourth process to form integrally a primary resin layer to cover the printed circuit board bottom and the perimeter portion of the base body by injecting resin into the upper and lower mold while adjusting the injection pressure in a stepwise manner, a fifth process to water-cool the upper and lower mold, a sixth process to arrange the base body in which the primary resin layer is formed in a second upper and lower mold, and seventh process to form integrally a secondary resin layer which covers the whole outer surface of the base body by injecting resin into the second upper and lower mold while adjusting the injection pressure in a stepwise manner, and an eighth process to water-cool the second upper and lower mold. <P>COPYRIGHT: (C)2008,JPO&INPIT |
