| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate of metal wiring and an insulation resin layer, having good adhesion, and to provide a circuit board using the laminate. SOLUTION: The laminate has the insulation resin layer 2 comprising a cured insulation resin composition containing a cured epoxy resin, and also containing a nitro group, a carboxy group and a cyano group, and contacting with a metal-including layer having the metal on the surface. The method for producing the laminate includes one of laminating the resin phase with the metal surface after curing an uncured insulation resin composition to afford the insulation layer, and curing the uncured insulation resin composition to afford the insulation layer after laminating the uncured insulation resin composition to the metal surface. COPYRIGHT: (C)2008,JPO&INPIT |
