| 摘要 |
PROBLEM TO BE SOLVED: To provide the drying device and drying method of a semiconductor substrate for suppressing the fluctuation of IPA density, and for performing stable drying processing. SOLUTION: The drying device of a semiconductor substrate in one configurations is provided with: a measuring means (6) for directly or indirectly measuring IPA density in a drying chamber (1) for drying a semiconductor substrate (W); a recognition means for recognizing the surface state of the semiconductor substrate; and a control means (100) for controlling IPA density in the drying chamber. The measurement means feeds back the measurement result of the IPA density to the control means, and the control means controls the IPA density based on the measurement result and the surface state recognized by the recognition means. COPYRIGHT: (C)2008,JPO&INPIT
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