BONDING STRUCTURE OF ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing technology with which damage such as erosion to a wiring circuit is suppressed as much as possible on an element where the wiring circuit formed of Al-based alloy is directly bonded to a transparent electrode and the highly reliable element is achieved. SOLUTION: In a bonding structure of having a transparent electrode and a wiring circuit formed of Al-based alloy which is directly bonded to the transparent electrode, a taper angle of a wiring circuit side is 20°to 75°. It is desirable that Al-based alloy is Al-Ni-based alloy and it is much more desirable that it is Al-Ni-B alloy. COPYRIGHT: (C)2008,JPO&INPIT